TECHNOLOGY INNOVATION
At Circuitronics LLC/Price Circuits LLC, we are always on top of the latest technologies available for our customers.
OUR TECHNOLOGY
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Rigid up to 36 layers
Flex up to 12 layers
Rigid Flex up to 18 layers
High Speed High Performance Speciality Materials:
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Rogers, Isola, Panasonic, AGC etc
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Hybrid – FR4/ Ceramic, PTFE, Polyimide, and more
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Thermal Management Solutions:
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Aluminum | Heatsink & Metalback
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Copper | Heatsink & Metalback
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Advanced HDI & High Density Interconnect Capabilities:
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Build-up Technology, Complex microvia structures
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Blind and buried via technology/ Laser
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Via in Pad technology (copper and epoxy filled microvias)
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Additional Technologies:
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Back Drilling
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Differential Impedance & Impedance Control
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Heavy Copper
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High Aspect Ratio Plating
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RF & Microwave PCB Specialist
EQUIPMENT SHOWCASE
VALUE ADDED ENGINEERING SERVICES
Design Guidance & Recommendations
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Materials​​
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Cost Drivers
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Rohs, WEEE and REACH
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Electrical Cad Layout Services
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​Engineering Concept and Design Review
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Design for manufacture, assembly & Cost
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Prototype/PilotRamp to Volume
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Full Volume Production
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Concept to Completion
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Impedance control to +/-7%
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TDR Impedance testing at Inner and outer layers
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Characteristic and differential pairs
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Full impedance simulation software
SPECIFICATIONS
STANDARD TECHNOLOGY
ADVANCED TECHNOLOGY
BOARD MATERIAL
MINIMUM BOARD THICKNESS
2 layer - 0.010" , 4 layer - 0.020", 6 layer - 0.040", 8 layer - 0.062", 10 layer - 0.062", 12 layer - 0.062".
2 layer - 0.005", 4 layer - 0.010", 6 layer - 0.031", 8 layer - 0.040".
MAXIMUM BOARD THICKNESS
2 layer - 0.125" 3-12 layer - 0.200"
0.250" - 0.325"
MAXIMUM BOARD SIZE
16.5" x 22.5"
17.0" X 23.0"
LAYER COUNT RIGID
18 Layers
36 Layers
LAYER COUNT FLEX
6 Layers
12 Layers
LAYER COUNT RIGID FLEX
6 Layers
12 Layers
COPPER THICKNESS
0.5 oz. - 3 oz.
4 oz. - 7oz.
HOLE ASPECT RATIO
10 : 1
15 : 1
MINIMUM HOLE SIZE
0.008"
0.005"
MECHANICAL DRILL
0.008"
0.005"
LASER DRILL
0.004"
0.003"
MINIMUM TRACE/SPACE
0.004"/0.004"
0.002"/0.002"
MINIMUM DRILL-TO-COPPER
0.010"
0.003"
MINIMUM PITCH
0.004"
0.002"
FINAL FINISH
HASL, Lead Free HASL, ENIG, Hard Gold, Gold Fingers, Immersion Silver, OSP,
ENEPIG, Wire BondableGold, Electroless Gold, Selective Gold, Immersion Tin.
SOLDER MASK
COVERLAY
LPI: Green, Black, Red, Blue, Clear.
FR Coverlay, LF Coverlay, Flexible Soldermask.
LPI: Yellow, White, Orange, Purple, Magenta, Dry Film.
LPI: Yellow, White, Orange, Purple, Magenta, Dry Film.
SILK SCREEN
White, Black, Yellow.
Green, Red, Blue.
PCB FABRICATION
Scoring, Route.
Jump Scoring, Milling, Laser Rout.
ADDITIONAL FEATURES
Plated Slots, Non-plated Slots, Controlled Dielectric, Covered Vias, Counter Sinks, Counter Bores, Dual Access Flex, Book Binder Flex.
Plated Edges, Plated Milling, Plated Counter Bores & Counter Sinks, Edge Castellation, Controlled Impedance, Silver Filled Vias, Non-Conductive Filled Vias, Copper Filled Vias, Plated Half Holes with clean edges.
QUALITY
IPC 6012 Class 1 & 2, IPC 6013 Class 1 & 2.
IPC 6012 Class 3, IPC 6013 Class 3, ITAR, ISO 9001/2008, 100% Netlist Testing, TDR Testing, X-Ray Fluorescence.
SPECIAL TECHNOLOGY
Blind & Buried Vias, Laser Drilled Vias, Stacked micro Vias, Copper Filled Vias, Metal Backed Boards, Rigid-Flex Boards, Flex Boards, Chip Modules.